TDK has introduced an ultra-compact NTC (Negative Temperature Coefficient) thermistor, measuring just 0.6 mm in length, 0.3 mm in width, and 0.2 mm in thickness, with a tight tolerance of ±1%. This advanced component features electrodes on its bottom, enabling flip-chip packaging, which is ideal for space-constrained applications.
The new NTC thermistor will be showcased at "CEATEC JAPAN 2011," held at the Makuhari Messe International Convention and Exhibition Center in Chiba Prefecture from October 4, 2011. TDK has targeted smartphone and tablet manufacturers as key customers, as these devices continue to push the boundaries of miniaturization and performance.
With the increasing demand for high-density packaging and higher clock speeds in application processors, TDK aims to integrate this NTC thermistor into the processor to maintain optimal thermal performance without compromising the device's design. The thermistor can be mounted directly under the application processor package or embedded within the LSI package resin or on the substrate side.
This innovative component is expected to enter sampling in January 2012, with mass production starting in April 2012. The sample price is set at 10 yen per unit, making it a cost-effective solution for next-generation electronic devices.
As the demand for smaller, more powerful devices continues to grow, TDK’s latest NTC thermistor represents a significant step forward in thermal management technology, offering improved reliability and efficiency for modern electronics.
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