TDK has introduced an ultra-compact NTC (Negative Temperature Coefficient) thermistor, measuring just 0.6 mm in length, 0.3 mm in width, and 0.2 mm in thickness, with a tight tolerance of ±1%. Featuring electrodes on the bottom, this component is designed for flip-chip packaging, making it ideal for high-density applications.
The new thermistor was showcased at "CEATEC JAPAN 2011," held at the Makuhari Messe International Convention and Exhibition Center in Chiba Prefecture from October 4, 2011. TDK targeted smartphone and tablet manufacturers with this innovation, as these devices continue to push the limits of miniaturization and performance.
With the need for high clock speeds in application processors, while maintaining thermal efficiency, TDK aims to integrate this NTC thermistor into the processor package. It can be mounted directly under the application processor or embedded within the LSI package resin or on the substrate side, ensuring precise temperature monitoring without increasing the device's footprint.
This advanced thermistor is expected to begin sampling in January 2012, with mass production starting in April 2012. The sample price is set at 10 yen per unit, offering a cost-effective solution for manufacturers looking to enhance thermal management in their next-generation devices.
As the demand for smaller, more powerful electronics continues to grow, TDK’s latest NTC thermistor represents a significant step forward in enabling high-performance, compact designs that meet the evolving needs of the mobile and consumer electronics markets.
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