How Vehicle SoCs Overcome Multiple Graphics and FinFET Challenges

At this year's International Solid State Circuits Conference (ISSCC 2016), two automotive system-on-a-chip (SoC)s became the most interesting and innovative chip technology demonstrations on the digital processor agenda; they are each based on MediaTek. And AMD's latest smartphones and PC processors contain more cores and more aggressive process technologies. The two car chips are designed by Renesas and adopt 16nm FinFET process, one of which is ISO26262 compliant, contains 8 ARMv8 cores, 2 ARM R7 cores and 3 ImaginaTIon graphics processing (GPU). The core car security chip; the other is a video processor chip for the car communication entertainment system and driver assistance system application, using six different types of 17 video processors.

“In the past, the technology enabler was a smart phone application processor, but the situation has changed;” Seiji Mochizuki, a senior engineer at Renesas who participated in the design of the video SoC, said in an interview with the US version of EE TImes that the vehicle was used. Demand for communication entertainment systems and driving note systems: "Car SoCs will require much higher performance than smart phone processors, and future car processors must be developed with the most advanced technology."

Another Renesas engineer in charge of vehicle safety SoC development, Chikafumi Takahashi added: "This is a demand from the market because we need to process a lot of information. David Kanter, a frequent visitor and microprocessor analyst at ISSCC, agrees. The power limit of a car is not as much as that of a mobile phone, and the demand for chips is growing rapidly, especially the autonomous vehicles that will be available in the next decade: "The slowdown in the mobile phone market means that everyone is looking for the next big business opportunity. Obviously, the data center field is already Intel's world, but there are still many opportunities in the automotive field that can be differentiated by vendors such as Nvidia. Kanter pointed out that the car is also a mature application environment that can integrate and virtualize many functions in a single chip, and can use the method of individual design in safety-critical functions as demonstrated by Renesas. Renesas' car video processor is now Samples have been available, but security chips are still being evaluated.

MediaTek smart phone application processor contains 10 cores

The car processor has not completely compared the mobile phone processor. Currently, only a few chips in the market use the 14/16 nm FinFET process; mainly the application processor of Apple (Apple) and Samsung (Samsung) smart phones. There is also Qualcomm's Snapdragon chip. After the latest smart phone processor released by MediaTek in ISSCC, it also integrated 8 Cortex-A53, 2 A57 cores, as well as GPU, data machine and multimedia subsystem. The chip uses a 20-nm process to divide the processor core into three clusters; the mid-range 2GHz A53 core cluster occupies a unique position, providing 40% higher performance than the lower-order 1.4G A53 core cluster, and higher-order performance. The 2.5 GHz A72 core cluster consumes 40% less power.

Uming Ko, vice president of technology at MediaTek, said that because of the small size of the chip, there are no restrictions on how many cores can be integrated in the mobile phone processor: "If you draw a straight line between ultra low power and high performance, there is enough The performance points allow you to continue to find the benefits of adding enough cores.” AMD engineers showcased a clever way to increase the performance of their PC processor Carrizo by 15%—by simply providing more aggressive power management techniques to The 28nm process is designed. The Bristol Ridge platform is designed to take advantage of power management schemes to overcome performance limitations associated with heat, voltage, and current.

16 nm design challenge

In addition, I also asked Renesas engineers about the design experience of the 16nm node. The processor design using this process needs to overcome the challenges of mulTI-patterning and FinFET. The chip architecture needs to be changed to some extent. But they have other opinions. Takahashi said: "The 16nm node has many challenges and difficulties... The work number is a problem, sometimes reliability is also a problem;" He pointed out that the 16nm chip memory unit is very small, and the memory lines (memory lines) It is very short and therefore more susceptible to software errors. ”

Takahasi also said that the foundry will provide 16nm interconnects, but lacks support for advanced features, such as Renesas' built-in quality-of-service controls on its own chip. In order to simplify the 16nm design and verification work, a higher order design language such as System C is required. In addition, Mochizuki pointed out that the 16nm chip uses a relatively high frequency clock and it is difficult to maintain low power consumption; he said that the 16nm node: "Compared with the previous generations of the process is less flexible...in order to reduce power consumption , we may need to change the design pattern."

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