On January 24, BOE Technology Group Co., Ltd. and China Development Bank signed the "Developmental Financial Cooperation Agreement" in Beijing. Governor of China Development Bank Zheng Zhijie, Director of the Second Assessment Bureau Wang Xuefeng, BOE (BOE) Chairman Wang Dongsheng, and CEO Chen Yanshun attended the signing ceremony. In the next five years, the two sides will achieve a strategic cooperation of 100 billion yuan in all types of financial products to achieve common development and mutual benefit. According to the agreement, the China Development Bank will actively support BOE (BOE) in the development of displays and sensors, smart systems, and health services, as well as related core and cutting-edge technology research and development. The two parties will accelerate the progress of BOE (BOE) 6th generation flexible AMOLED production line and Wuhan 10.5 TFT-LCD production line and other semiconductor display production lines; promote e-label projects and the development of smart manufacturing projects such as Hefei and Suzhou; and accelerate digital hospitals such as Hefei and Chengdu. layout. BOE (BOE) is the world's leading provider of Internet of Things technologies, products, and services; China Development Bank is China's development financial institution and medium- and long-term investment and financing main bank. The two sides will establish a full-scale and deep-going cooperation between new industrial groups and financial institutions. Strategic partnership, complement each other, and jointly promote industrial development.